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Merchants of capacitor screen laminating machine explain the structure of projection capacitor touch control panel
Jan 07, 2019

The enterprise of capacitor screen lamper has learned that, on the whole, the capacitor touch panel can almost be regarded as a quadratic expansion version of the touch switcher when using the capacitive sensing method. Because the principle of the projective capacitive touch technology is to define the position on the touch panel by the static electricity on the finger, it has a high reliability. Different from the way of the deformation of the impedance membrane electrode, the projective capacitive touch panel can also be sensed 10 mm from the surface of the touch panel.

According to the understanding of enterprises of capacitor screen laminating machine, the components of projected capacitor touch panel module include touch Sensor glass and soft circuit board (FPC); Flexible Print Circuit); The touch sensitive glass is a single piece of ITO(Indium Tin Oxide) glass, non-sandwich stack structure. Instead of using ITO film, it is coated on a piece of glass to directly make the line pattern, and evenly distributed electric field is set around the induction area. The soft circuit board is responsible for the transmission of signals. On the soft board, there are circuits, touch controllers and linkers. The signals from the touch sensor glass will be transmitted to the touch controller for determination.

According to the understanding of enterprises of capacitive screen lamper, the manufacturing process of projective capacitive touch panel is complicated, the manufacturing process time and cost are high, and the yield is not high, which is a high-priced product. Whether manufacturers can improve and evolve the manufacturing process has become the key to profit. The main process is belong to yellow light process, namely the lithographic process, basically include polish resistance agent (coating photoresist on a chip), soft bake (increase the photoresist in the chip surface adhesion), alignment and exposure (moving mask on component design graphics to photoresist), baking (reduce the standing wave effect), development (photoresist formed component design graphics), hard baked (removal of residual solvents, increase the intensity of light resistance).

Some simple processes may simplify photoresist, exposure, and development, but they all involve photoresist. Photoresist is photosensitive material, is similar to traditional camera film on the photosensitive material, can choose in the semiconductor process of ultraviolet (UV) sensitive photographic materials, because is sensitive to UV, of blue, green and some reaction, but there is no lighting, people can't see and can't operation, so need to have the lighting light source, but can't have blue, green, and yellow light is used for lighting.